Capabilities

  • ATE/Load Boards, RF Boards, Burn-in-Boards, evaluation boards, prototypes, volume production.
  • High layer count PCBs.
  • High Aspect ratio.
  • BGA, Micro BGA.
  • Blind / Buried / Laser / Micro Vias.
  • Controlled Impedance – micro strip, stripline, Differential pairs.
  • HDI.
  • Rigid, Flex, Rigid - Flex Circuits, Metal Core PCBs.
  • Materials – RoHS compliance, ISola products, High Tg materials, 370HR, Rogers, Nelco.
  • Conductive and Non conductive viafill.
  • EMC/EMI compliance.
  • Equal length routing.
  • Simulation.
  • Stack - ups.
  • Signal Integrity.
  • DFM/DFA/DFT.